Low loss glass-ceramic materials, method of making same and electronic packages including same
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United States of America Patent
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Jun 17, 2008
Grant Date -
Dec 1, 2005
app pub date -
Mar 18, 2005
filing date -
May 27, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A glass-ceramic is provided having a thermal expansion coefficient in a range of 3-6 ppm/.degree. C., a dielectric constant that is less than 5 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO.sub.2 in a range of 45-58 wt %, Al.sub.2O.sub.3 in a range of 10-18 wt % and MgO in a range of 10-25 wt %. A method of making the glass-ceramic is also provided. Further, an electronic package is also provided, including a base member and a glass-ceramic substrate bonded to the base member.
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