Platable coating and plating process
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United States of America Patent
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Jun 10, 2008
Grant Date -
May 18, 2006
app pub date -
Nov 16, 2004
filing date -
Nov 16, 2004
priority date (Note) -
Expired
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Abstract
A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of a platable coating composition to the substrate prior to plating. The platable coating composition is cured to render the substrate more receptive to conventional plating techniques. In one embodiment, the process utilizes an epoxy resin system that upon being cured is receptive to electroless plating and electrolytic plating techniques that are the same or similar to those conventionally employed for electroplating ABS and/or PC/ABS substrates.
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