Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
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United States of America Patent
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Jun 10, 2008
Issued Date -
N/A
app pub date -
Nov 19, 2004
filing date -
Nov 19, 2004
priority date (Note) -
Expired
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Abstract
A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided, as is a method of making the substrate.
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