Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7382619
APP PUB NO 20050254218A1
SERIAL NO

11127238

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The invention provides an electric apparatus having a printed circuit board with an improved heat dissipation capacity, and, in particular, to provide an electric apparatus requiring plural printed circuit boards that has an improved heat dissipation efficiency and can be produced at a low cost.A main printed circuit board 10 and a sub board 17 are composite-molded, and the sub board 17 is formed at an area close to or immediately below a heat-generating electronic component 23 or a heat dissipation plate 23a. Thus, by separating the sub board 17 off the main printed circuit board 10, a hole serving as a ventilating hole is formed in the main printed circuit board 10 at the area close to or immediately below the heat-generating electronic component 23 or the heat dissipation plate 23a.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ORION ELECTRIC CO LTD41-1 IEHISA-CHO ECHIZEN-CITY FUKUI 915-8555

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mouri, Yoshitaka Takefu, JP 3 5

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation