Stacked contact bump
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 27, 2008
Grant Date -
Dec 6, 2007
app pub date -
May 30, 2006
filing date -
May 30, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.
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