Magnetron sputtering
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 27, 2008
Grant Date -
May 27, 2004
app pub date -
Jul 18, 2001
filing date -
Jul 27, 2000
priority date (Note) -
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Abstract
A magnetron sputtering apparatus has a controller for selectively releasing the spread of plasma on a substrate on a support. The controller can also contain the plasma when the substrate is to be coated with the target material. This enables cleaning of the target surface during intervals between deposition of target material onto a desired substrate, such as a wafer, and ensures that layers or flakes of back-scattered deposited target material do not build up on the target itself. A platen coil is located between the magnetron and the support to increase both uniformity and density of target material arriving nearly normal to the substrate surface.
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