Bond head link assembly for a wire bonding machine
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United States of America Patent
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May 27, 2008
Grant Date -
Dec 21, 2006
app pub date -
Jun 15, 2005
filing date -
Jun 15, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.
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