Method and device for drying substrate
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United States of America Patent
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May 27, 2008
Grant Date -
N/A
app pub date -
Jan 17, 2000
filing date -
Jan 17, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device for drying substrate comprising a processing vessel housing a specified number of substrates such as semiconductor wafers installed erectedly in parallel to one another, a first substrate supporting member supporting substrates within the processing vessel, the processing fluid supplying section supplying to the processing vessel, the processing fluid for performing processing such as cleaning processing on the substrates, a processing fluid exhausting section exhausting processing fluid from the processing vessel, and a drying fluid supplying section supplying, to the processing vessel, the liquid drops of drying fluid for performing drying processing on the substrates.
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