Optical fiber component package for high power dissipation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 13, 2008
Grant Date -
Sep 6, 2007
app pub date -
Jan 22, 2007
filing date -
Jan 23, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package for an optical fiber device is disclosed. It has a high thermal conductivity packaging substrate surrounding the optical fiber device and has adhesive bonds at each end anchoring the optical fiber device to the substrate. The adhesive bonds are made of a material that has high transparency in damp heat as well as a high glass transition temperature and is capable of withstanding temperatures of over 100.degree. C. The packaging substrate has a high absorption capacity and a CTE in relation to the CTE of the adhesive bond, such as to compensate for any variation in the adhesive bond due to temperature variations. This allows to limit mechanical stress in the optical fiber device within the package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully