Process for wafer thinning
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United States of America Patent
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May 13, 2008
Grant Date -
Mar 27, 2008
app pub date -
Sep 27, 2006
filing date -
Sep 27, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a process for thinning a semiconductor wafer. Two surfaces of the wafer separately form a surface-bond glue (layer) and a surface protective glue (layer). The thinning process is applied to the wafer before forming the surface protective glue. Once the baking and drying process is applied to the surface-bond glue and the surface protective glue it then cuts the wafer. Finally, it dissolves the lower solubility of the surface protective glue to obtain the finished goods. The necessity of the selection of the wafer may serve to maintain quality standards. The wafer thinning process of the present invention is suitable for the extremely thin wafer. Thus, it reduces the production cost.
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