Circuit board and a power module employing the same
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United States of America Patent
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May 6, 2008
Grant Date -
Mar 23, 2006
app pub date -
Nov 9, 2005
filing date -
Mar 26, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a lower part of adjacent elements of the pattern on the metal layer which is in contact with the insulator is not greater than the thickness of the metal layer. Also a power module containing such circuit board.
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