Adhesive composition and flexible packaging composite film

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7364796
APP PUB NO 20050272898A1
SERIAL NO

10522016

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Abstract

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Adhesive composition and a flexible packaging composite film that can produce a reduced amount of low-molecular-weight compounds eluted into contents of a composite film to prevent spoilage of inherent properties or performances of the contents, can produce improved oil resistance to prevent significant reduction in strength even when used for oily contents, and can develop favorable flexibility of the composite film to prevent reduction in peel strength. Polyester polyamide polyol and/or polyurethane polyester polyamide polyol including an amide bond produced by reaction between a dimer acid and polyamine is prepared as a polyol component and also concentration of a cyclic compound formed by the amide bond and/or an ester bond in extracted water which is extracted from a composite film adhesively bonded by the adhesive composition by water of 0.5 mL/cm.sup.2 per unit area of the composite film is set to be 0.5 ppb or less in terms of dibutyl phthalate concentration measured with a gas chromatograph-flame ionization detector.

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Patent Owner(s)

Patent OwnerAddress
MITSUI TAKEDA CHEMICALS INCTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Igarashi, Sachio Osaka, JP 9 101
Sasano, Shigetoshi Osaka, JP 10 61

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