Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
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United States of America Patent
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Apr 29, 2008
Grant Date -
Dec 21, 2006
app pub date -
May 13, 2003
filing date -
May 13, 2003
priority date (Note) -
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Abstract
It is an object of the present invention to provide a wafer release method capable of releasing a wafer safely, simply and certainly and improving a wafer releasing rate, a wafer release apparatus and a wafer release transfer machine using the wafer release apparatus. A wafer release method of the present invention comprises the steps of: pressing the uppermost wafer along an axis direction (L-L') shifted by an angle in the range of from 15 to 75 degrees from a crystal habit line axis (A-A') or (B-B') of the uppermost wafer clockwise or counterclockwise; bending upwardly the peripheral portion of the uppermost wafer so as to cause a bending stress in the uppermost wafer in the axis direction (L-L') shifted by the angle; blowing a fluid into a clearance between the lower surface of the uppermost wafer and the upper surface of the lower wafer adjacent thereto; and raising the uppermost wafer for releasing.
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