Method of manufacturing a multilayer printed wiring board
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United States of America Patent
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Apr 29, 2008
Grant Date -
Jun 29, 2006
app pub date -
Aug 25, 2005
filing date -
Dec 27, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
This invention provides a multilayer printed wiring board having flat via holes. This is a multilayer printed wiring board formed by alternately laminating multiple metal foils and insulating layers, in which an interlayer connection via pad provided in a first insulating layer, a wiring circuit and an interlayer connection via bottom pad of a second insulating layer are provided in the same surface layer and at least the interlayer connection via pad and the interlayer connection via bottom pad of the second insulating layer have the same thickness.
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