Method for wafer-level package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 22, 2008
Grant Date -
Sep 20, 2007
app pub date -
Jun 23, 2006
filing date -
Mar 14, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for wafer-level package. A cap wafer having cavities is bonded to a support wafer, and a portion of the cap wafer is etched through. The cap wafer is released from the support wafer, and bonded to a transparent wafer, and a portion of the cap wafer corresponding to the cavities is removed so that the remaining cap wafer forms a plurality of support blocks. A device wafer is provided, and the support blocks are bonded to the device wafer so that the support blocks and the transparent wafer hermitically seal the devices disposed in the device wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully