Process condition sensing wafer and data analysis system
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United States of America Patent
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Apr 22, 2008
Grant Date -
Apr 22, 2004
app pub date -
Oct 14, 2003
filing date -
Jan 24, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
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