Multichip circuit module and method for the production thereof
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United States of America Patent
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Apr 15, 2008
Grant Date -
Jan 18, 2007
app pub date -
Jul 20, 2004
filing date -
Aug 7, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multichip circuit module includes a main board, at least one carrier substrate mounted on and in electrical contact with the main board, and at least one semiconductor chip arranged on the carrier substrate and in electrical contact therewith. The carrier substrate has at least one cavity on an assembly surface for receiving the semiconductor chip. The cavity includes connecting contacts which join with associated bumps on the semiconductor chip using a flip-chip technique. The assembly surface of the carrier substrate is placed on a contact surface of the main board, and a filling material is provided between the contract surface of the main board and the assembly surface of the carrier substrate.
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