Wafer machining adhesive tape, and its manufacturing method and using method
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United States of America Patent
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Apr 15, 2008
Grant Date -
Jul 14, 2005
app pub date -
Dec 6, 2004
filing date -
Nov 22, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut into chips using a dicer. The adhesive layer of the tape has a storage modulus G' of 1 MPa or more at a temperature of 15 to 35.degree. C., and preferably tan .delta. as represented by the ratio of a loss modulus G'' to the storage modulus G' is 0.05 or less. The adhesive layer is preferably constructed principally of an olefin polymer.
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