Component connecting apparatus
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United States of America Patent
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-
Apr 15, 2008
Issued Date -
N/A
app pub date -
Jul 15, 2004
filing date -
Jul 17, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.
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