Mold die for a semiconductor device
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United States of America Patent
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-
Apr 8, 2008
Grant Date -
Sep 16, 2004
app pub date -
Mar 11, 2004
filing date -
Mar 11, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a surface of a wiring board which has a plurality of openings and on which a semiconductor chip is mounted via an elastic material. The second die is disposed on a back surface of the wiring board opposite the surface on which the semiconductor chip is mounted. The mold is used for sealing with an insulating resin the periphery of the semiconductor chip and at least one of the openings of the wiring board, wherein the above-described second die has a protrusion around an area overlapping the opening to be sealed with the insulating resin.
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