Delineation of wafers
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United States of America Patent
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Apr 8, 2008
Grant Date -
Jul 6, 2006
app pub date -
Jan 6, 2005
filing date -
Jan 6, 2005
priority date (Note) -
Expired
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Abstract
A method of junction delineation of non-epitaxial wafers comprises the steps of preparing a sample of the wafer, staining the sample using a mixture of between one and three parts hydrofluoric acid to fifty parts nitric acid to twenty parts water, and scanning the sample with a scanning electron microscope.
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