Diffusion bonding for metallic membrane joining with metallic module
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United States of America Patent
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Apr 8, 2008
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app pub date -
Nov 25, 2003
filing date -
Nov 25, 2003
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Abstract
This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature above the half melting point of the metallic membrane while subjecting the metallic membrane and metallic part to a controlled environment of a proper gas atmosphere. The metallic membrane can comprise palladium and the pressurized gas can comprise one of hydrogen, an inert gas or their mixture.
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