Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
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United States of America Patent
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Apr 1, 2008
Grant Date -
Jul 27, 2006
app pub date -
Sep 22, 2005
filing date -
Jan 7, 2005
priority date (Note) -
Expired
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Abstract
A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishing even though the slurry has low solids-content. The slurry comprises a bicarbonate salt, which acts as a catalyst for increasing removal rates of dielectric films during polishing of these substrates.
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