Metal-ceramic circuit board
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United States of America Patent
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Mar 25, 2008
Grant Date -
May 2, 2002
app pub date -
May 3, 2001
filing date -
Sep 4, 2000
priority date (Note) -
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Abstract
A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stress not higher than 320 (MPa) and a thickness not smaller than 1 mm.
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