Plating method
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United States of America Patent
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Mar 18, 2008
Grant Date -
Jan 29, 2004
app pub date -
Apr 7, 2003
filing date -
Apr 11, 2002
priority date (Note) -
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Abstract
Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging.
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