Removable modules with external I/O flexibility via an integral second-level removable slot
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United States of America Patent
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Mar 11, 2008
Grant Date -
Jul 27, 2006
app pub date -
Sep 13, 2005
filing date -
May 11, 1999
priority date (Note) -
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Abstract
The functionality provided to electronic devices by application specific removable modules is enhanced by viewing the removable modules as first-level removable modules and providing them with at least one second-level removable slot for selectively nesting second-level removable modules having particular external I/O capabilities. The functionality provided to the electronic devices by such a first-level removable module can thus be provided in part by the application specific circuitry within the removable module and further in part by the type of external I/O of the second-level removable module.
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