Lead frame for semiconductor package and method of fabricating semiconductor package
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United States of America Patent
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Mar 11, 2008
Grant Date -
Aug 25, 2005
app pub date -
Aug 20, 2004
filing date -
Feb 23, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.
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