Method of and device for packaging electronic components thus packaged
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United States of America Patent
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Mar 11, 2008
Grant Date -
Feb 17, 2005
app pub date -
Nov 25, 2002
filing date -
Dec 5, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a method of packaging an electronic component such as semiconductor device, where by the component is positioned in a cavity of a foil by tweezers and is supported by means of a further foil which is attached to the foil at one side thereof. According to an example embodiment, the component is first placed into the cavity of the foil by the tweezers, and only after that is the further foil positioned adjacent thereto and attached to the foil. The tweezers are moved through the foil to pick up the component, hold it, and move it into the cavity. A feature of this embodiment is that the component may be temporarily supported by a supporting means after being positioned in the cavity and before being attached to the further foil, and the foil with the component is moved in a longitudinal direction (L) of the foil.
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