Laminate and process for producing the same
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United States of America Patent
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Mar 4, 2008
Grant Date -
Apr 8, 2004
app pub date -
Feb 25, 2002
filing date -
Feb 16, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to a laminate comprising an insulating polyimide resin layer etchable by an aqueous alkaline solution and a metal foil. The laminate has an insulating resin layer composed of a plurality of polyimide resin layers on the metal foil and the insulating resin layer has at least one polyimide resin layer (A) with a coefficient of linear thermal expansion (CTE) of 30.times.10.sup.-6/.degree. C. or less and at least one polyimide resin layer (B) with a glass transition temperature (Tg) of 300.degree. C. or below, the layer in contact with the metal foil is the polyimide resin layer (B), the bonding strength between the metal foil and the polyimide resin layer (B) in contact therewith is 0.5 kN/m or more, and the average rate of etching of the insulating resin layer by a 50 wt % aqueous solution of potassium hydroxide at 80.degree. C. is 0.5 .mu.m/min or more. The laminate is useful for flexible printed circuits and the like.
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