Injection molding method and injection molding apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7338627
APP PUB NO 20050012243A1
SERIAL NO

10632844

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Abstract

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The present invention provides an injection molding method which intends to lower a mold clamping force in view of both of a projected area of a molded article and an injection pressure, and contributes to an energy saving and a reduction in a cost of equipment and a manufacturing cost. In a cavity (13) formed in a metal mold (5) for an injection molding, there are arranged a first gate (21) injecting a first molten resin (101) anteceding in one end side (a charging start side) in a longitudinal direction, and a second gate (22) injecting a second molten resin (102) following in another end side (a charging finish side). The second molten resin (102) is newly injected from the second gate (22) before a fluid head portion of the first molten resin (101) injected from the first gate (21) reaches a position of the second gate (22). Further, the first molten resin (101) becomes in an approximately cooled and solidified state by the time when the second molten resin (102) reaches a terminal end in the charging finish side within the cavity (13).

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Patent Owner(s)

Patent OwnerAddress
DAIWA KASEI INDUSTRY CO LTD1 KAMIHIRACHI HOBO-CHO OKAZAKI-SHI AICHI 444-0004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hanai, Kazuhiro Okazaki, JP 2 12
Hazama, Syuuichi Okazaki, JP 4 16
Isogai, Katsumasa Okazaki, JP 2 12
Saeki, Toshi Okazaki, JP 4 43
Suzuki, Makoto Okazaki, JP 488 4914

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