Method for forming an electrical interconnect to a spring layer in an integrated lead suspension
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United States of America Patent
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Mar 4, 2008
Grant Date -
Sep 8, 2005
app pub date -
Mar 5, 2004
filing date -
Mar 5, 2004
priority date (Note) -
Withdrawn
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Abstract
A method for forming an electrical interconnect to the spring metal layer in an integrated lead suspension or suspension component of the type having a multi-layer structure including a spring metal layer and a conductor layer separated by a dielectric insulator layer. The method includes forming an aperture through at least one of either the spring metal and conductor layers, and optionally through the dielectric layer, at an interconnect site. A first mass of malleable conductive metal is inserted into the aperture. The mass of metal is then coined to form a stud that engages at least the spring metal layer at the interconnect site.
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