Method and apparatus for measuring shape of bumps
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United States of America Patent
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Feb 26, 2008
Grant Date -
Jun 16, 2005
app pub date -
Oct 15, 2004
filing date -
Oct 17, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit.
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