Reduced pin count test method and apparatus
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United States of America Patent
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Feb 26, 2008
Grant Date -
Nov 24, 2005
app pub date -
May 21, 2004
filing date -
May 21, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Testing of an electronic device is carried out by combining power and signal delivery on a single pair of wires. The power delivery is decoupled from the signal delivery, using inductors, so the device power supplied does not interfere with the test signals delivered from the device and the response signals delivered to the device. Further, simultaneous bidirectional signal paths are decoupled, using capacitors, so that the tester transceiver and the device transceiver are not damaged by the power delivered to the device on the same wires. A common fixture may be used to test a number of different types of wafers, independent of the topography, size, or power requirements of the devices on the wafers, resulting in a significant cost saving, because fixture design has become very expensive, in some cases costing more than the tester whose signals it is implemented to deliver.
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