Method for securing ceramic structures and forming electrical connections on the same
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United States of America Patent
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Feb 26, 2008
Grant Date -
May 12, 2005
app pub date -
Oct 30, 2003
filing date -
Oct 30, 2003
priority date (Note) -
Expired
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Abstract
A new kinetic spray process is disclosed that enables one to secure a plurality of ceramic elements together quickly without the need for glues or other adhesives. The process finds special utilization in the formation of non-thermal plasma reactors wherein the kinetic spray process can be used to simultaneously secure the ceramic elements together and to form electrical connections between like electrodes in the non-thermal plasma reactor.
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