Semiconductor stress buffer coating edge bead removal compositions and method for their use
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United States of America Patent
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Feb 26, 2008
Grant Date -
Dec 11, 2003
app pub date -
Feb 6, 2003
filing date -
Feb 6, 2002
priority date (Note) -
Expired
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Abstract
An edge bead remover composition that includes at least one ketone selected from the group consisting of: ##STR00001## wherein R.sub.1 and R.sub.2 are independently selected from the group consisting of: methyl, ethyl, n-propyl, n-butyl, sec-butyl, and isobutyl, and wherein n equals 1 or 2; at least one ester other than lactones; and at least one lactone.
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