Radiation-sensitive negative-type resist composition for pattern formation method
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United States of America Patent
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Feb 12, 2008
Grant Date -
Aug 3, 2006
app pub date -
Aug 29, 2003
filing date -
Aug 30, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The radiation-sensitive negative-type resist composition for pattern formation containing an epoxy resin, a radiation-sensitive cationic polymerization initiator, and a solvent for dissolving the epoxy resin therein, characterized in that the resist composition, through drying, forms a resist film having a softening point falling within range of 30 to 120 C and that the epoxy resin is represented by formula (1): (wherein R1 represents a moiety derived from an organic compound having k active hydrogen atoms (k represents an integer of 1 to 100); each of n.sub.1, n.sub.2, through n.sub.k represents 0 or an integer of 1 to 100; the sum of n.sub.1, n.sub.2, through n.sub.K falls within a range of 1 to 100; and each of 'A's, which may be identical to or different from each other, represents an oxycyclohexane skeleton represented by formula (2): (wherein X represents any of groups represented by formulas (3) to (5): and at least two groups represented by formula (3) are contained in one molecule of the epoxy resin)) ##STR00001##
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