Integrated circuit package encapsulating a hermetically sealed device
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United States of America Patent
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Feb 5, 2008
Grant Date -
Jul 27, 2006
app pub date -
Jan 21, 2005
filing date -
Jan 21, 2005
priority date (Note) -
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Abstract
An integrated circuit package is disclosed having a semiconductor chip, a device supported by the semiconductor chip, and a molding compound sealing the semiconductor chip and the device together as a composite package. A method of manufacturing the package is also disclosed.
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