Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
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United States of America Patent
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Jan 8, 2008
Grant Date -
Mar 1, 2007
app pub date -
Aug 23, 2006
filing date -
Aug 24, 2005
priority date (Note) -
Expired
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Abstract
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a ketoxime compound and water. The composition may also contain an abrasive and/or a per compound oxidizing agent. The composition affords tunability of removal rates for metal, barrier material, and dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).
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