Method for local wafer thinning and reinforcement
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United States of America Patent
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Jan 1, 2008
Grant Date -
Nov 30, 2006
app pub date -
May 27, 2005
filing date -
May 27, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method is provided for preparing a semiconductor wafer for testing. The method includes selecting a die to be tested; measuring a diagonal of the die; thinning an area over the die extending beyond the scribe lines, the thinned area may be a circular area having a diameter that is larger than the measured diagonal; providing an insert inside the thinned area; and providing an adhesive on the peripheral area of the insert so as not to obscure the optical path to the die. The insert is advantageously made of an undoped silicon.
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