Electronic member, method for making the same, and semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 25, 2007
Grant Date -
Mar 31, 2005
app pub date -
Oct 22, 2003
filing date -
Oct 23, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides an electronic device having high insulating reliability, in which metal portions of a circuit are not electrically conductive with each other via an adhesive layer even when the electronic device is used in high-temperature low-humidity conditions or high-temperature high-humidity conditions, and provides a production method for the electronic device, and a semiconductor device comprising the electronic device. In the electronic device in which a circuit formed by pattern formation of metal portions is attached via an adhesive layer to an insulating base, the adhesive layer, which contacts adjacent metal portions, is divided. Typically, the electronic device is one of a lead frame having a lead frame fixing tape, a TAB tape, and a flexible printed circuit board.
First Claim
Other Claims data not available
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 5 Citation Count
- H01L Class
- 2.46 % this patent is cited more than
- 18 Age
