Sputter target and method for fabricating sputter target including a plurality of materials
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 25, 2007
Grant Date -
Oct 21, 2004
app pub date -
Dec 19, 2003
filing date -
Jul 23, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of fabricating a sputter target comprises: homogenously blending a plurality of powders including at least a first powder and a second powder. The first powder is comprised of chromium (Cr), cobalt (Co), ruthenium (Ru), nickel (Ni), or iron (Fe). The second powder is comprised of boron (B), carbon (C), a nitrogen (N)-containing material, a boride, a carbide, a nitride, a silicide, an oxygen (O)-containing material or an oxide. The second powder has a particle size of between 0.01 microns and 50 microns. The method further comprises: canning the blended plurality of powders to form a substantially non-segregated encapsulated powdered material mix; pressing the encapsulated powdered material mix to form a billet; and machining the billet to form a sputter target.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully