Heat dissipation mechanism for electronic apparatus
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United States of America Patent
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Dec 11, 2007
Grant Date -
May 26, 2005
app pub date -
Feb 11, 2005
filing date -
Nov 30, 2004
priority date (Note) -
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Abstract
This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.
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