Patternable low dielectric constant materials and their use in ULSI interconnection
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United States of America Patent
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Dec 11, 2007
Grant Date -
May 18, 2006
app pub date -
Dec 21, 2005
filing date -
Jan 8, 2003
priority date (Note) -
Expired
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Abstract
The present invention relates to ultra-large scale integrated (ULSI) interconnect structures, and more particularly to patternable low dielectric constant (low-k) materials suitable for use in ULSI interconnect structures. The patternable low-k dielectrics disclosed herein are functionalized polymers that having one or more acid-sensitive imageable functional groups.
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