Use of fluorinated additives in the etching or polishing of integrated circuits
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United States of America Patent
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Dec 11, 2007
Grant Date -
Aug 7, 2003
app pub date -
Jan 31, 2003
filing date -
Feb 1, 2002
priority date (Note) -
Expired
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Abstract
Use in etching or polishing of integrated circuits of fluorinated additives of formula (I): T'(C.sub.3F.sub.6O).sub.n(CFXO).sub.mT (I) having a number average molecular weight in the range 250 400, in particular of the compound Cl(CF.sub.2--CF(CF.sub.3)O).sub.nCF.sub.2COONa.
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