Non-dripping nozzle apparatus
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United States of America Patent
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Dec 11, 2007
Grant Date -
Mar 9, 2006
app pub date -
Oct 18, 2005
filing date -
Dec 22, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
According to one aspect of the invention, a dispense head for a wafer processing apparatus is provided. The dispense head may include an inlet, at least one outlet, a drain, and a passageway therethrough interconnecting the inlet, the outlet, and the drain. The inlet may be at a first height above a bottom of the passageway, the outlet may be a second height above the bottom of the passageway, and the drain may be a third height above the bottom of the passageway. A first valve may be connected to the inlet, and a second valve may be connected to the drain. When the first valve is opened and the second valve is closed, fluid flows into the inlet and out of the outlet. When the second valve is opened and the first valve is closed, fluid from the passageway flows out of the drain. A pump may be connected to the drain.
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