High frequency laminated component and its manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 20, 2007
Grant Date -
Jan 20, 2005
app pub date -
Dec 22, 2003
filing date -
Jan 14, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a high frequency laminated component, which is used in a high frequency apparatus such as a radio communication apparatus, and its manufacturing method. An object thereof is to downsize the high frequency laminated component. To achieve the object, according to the high frequency laminated component of the present invention, dielectric layer (4) whose dielectric constant is lower than that of other areas is formed around via-hole electrode (3) in a dielectric. By forming dielectric layer (4) having a low dielectric constant, electric interference between via-hole electrode (3) and circuit electrode (22) is restrained, so that the circuit electrode and the via-hole electrode can be formed more closely each other compared with a conventional one. As a result, the high frequency laminated component can be downsized.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully