Multi-chip device and method for producing a multi-chip device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 20, 2007
Grant Date -
Dec 21, 2006
app pub date -
Jun 17, 2005
filing date -
Jun 17, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a multi-chip device comprising a plurality of chip stacks each including a plurality of single chips stacked on each other, wherein the stacked single chips are electrically interconnected by one or more through-chip-connection extending through at least one of the single chips and a substrate providing one or more first contact elements each of which is in contact with one of the through-chip-connections and providing one or more second contact elements being in electrical contact with the first contact elements, wherein the plurality of chip stacks are stacked onto each other and wherein the second contact elements of one of the chip stacks each being arranged to be in contact to one or more third contact elements of an adjacent one of the chip stacks.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully