Method of fabricating printed circuit board having embedded multi-layer passive devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7293356
APP PUB NO 20060203456A1
SERIAL NO

11325557

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDGYEONGGI DO KOREA SUWON SUWON GYEONGGI-DO

International Classification(s)

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  • 2006 Application Filing Year
  • H01K Class
  • 125 Applications Filed
  • 50 Patents Issued To-Date
  • 40 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20062007200820092010201120122013201420152016201720180255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chung, Yul Kyo Gyeonggi-do, KR 62 531
Jin, Hyun Ju Busan, KR 9 171
Park, Eun Tae Gyeonggi-do, KR 55 346
Sohn, Seung Hyun Gyeonggi-do, KR 18 192

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Patent Citation Ranking

  • 86 Citation Count
  • H01K Class
  • 97.37 % this patent is cited more than
  • 18 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2206333101 - 1011 - 2021 - 3031 - 4041 - 5081 - 900123456789101112131415161718192021

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