Method of fabricating printed circuit board having embedded multi-layer passive devices
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United States of America Patent
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Nov 13, 2007
Grant Date -
Sep 14, 2006
app pub date -
Jan 3, 2006
filing date -
Mar 11, 2005
priority date (Note) -
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Abstract
The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.
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