Negative photosensitive composition and negative photosensitive lithographic printing plate
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United States of America Patent
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Nov 6, 2007
Grant Date -
Nov 9, 2006
app pub date -
Jun 17, 2004
filing date -
Jun 18, 2003
priority date (Note) -
Expired
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Abstract
There are provided a negative-working photosensitive composition which can be cured by infrared rays and is less likely to suffer polymerization inhibition by oxygen during radical polymerization, and also exhibits high adhesion with a metal, and a negative-working photosensitive lithographic printing plate which is capable of directly forming images by irradiation with infrared rays from a solid or semiconductor laser based on digital signals, and also has high sensitivity and excellent printing durability. The negative-working photosensitive composition contains an infrared absorber (A), an organoboron compound (B) which functions as a polymerization initiator by using in combination with the infrared absorber (A), a compound having a polymerizable unsaturated group (C) and a diazo resin (D), and the negative-working photosensitive lithographic printing plate comprises a support, and a photosensitive layer containing the negative-working photosensitive composition formed on the support.
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