Process for high strength, high conductivity copper alloy of Cu-Ni-Si group
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United States of America Patent
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Nov 6, 2007
Grant Date -
Mar 24, 2005
app pub date -
Sep 23, 2003
filing date -
Sep 23, 2003
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Expired
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Abstract
A process for producing a copper-nickel-silicon alloy having a yield strength above 90 ksi with an electrical conductivity above 50% IACS. The process includes melting and continuously casting raw material to obtain an alloy containing 1-3 wt. % nickel, 0.2 to 0.7 wt. % silicon, remainder copper and unavoidable impurities; cold delivering the alloy to form a cold-rolled alloy, solution annealing the cold-rolled alloy; cold rolling the annealed alloy; and precipitation annealing the cold-rolled annealed alloy at a temperature of 450-500 degrees C. for four to ten hours with a cooling rate of 10-20 degrees C. per hour.
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